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Everspin Announces Production Release of 1 and 2 Gigabyte nvNITRO NVMe SSDs
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8/18 Lumerical CMOS Image Sensor Design within FDTD Solutions and DEVICE
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9/28 Intel FPGA Technology Day (IFTD) in Taipei
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Ideal solution for QC3.0 18W USB Car charging-Intersil ISL8117A+ Genesys Logic GL883A
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Intel® Cyclone® 10 FPGA
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Highly Integrated Capacitive-Digital Converter Delivers Superior Gesture Sensing and Enhanced Touch Performance to Automotive and Industrial Systems
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Mellanox Solutions Technical Seminar
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Everspin displays both the 1Gb DDR4 Perpendicular ST-MRAM device and a 1GByte DDR3 Memory Module (DIMM) at Stand A3-545
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Cypress Technical Video Clips
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By Adam McPadden, Lead Engineer, Burlington Systems Lab, IBM
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