Ansys Icepak provides powerful electronic cooling solutions which utilize the industry-leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs) and electronic assemblies.

Engineers can rely on Icepak for an integrated electronics cooling solution for electronic applications ranging in scale from individual ICs to packages and PCBs, up to computer housings and entire data centers. The Icepak solver performs conduction, convection and radiation conjugate heat transfer analyses. It has many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection.



Key Applications

Ansys Icepak is used to evaluate the thermal management of electronic systems in a wide range of applications, including simulation of air flow in enclosures, analysis of temperature distributions in chip and board-level packages, and detailed thermal modeling of complex systems such as telecommunications equipment and consumer electronics.

IC package PCB
Computer housing Smartphone biocompatibility

Related Information


Ansys Icepak – Brochure/strong>


Staying Cool with Ansys Icepak


Predicting Circuit Board Hot Spots with Electrothermal Co-simulation


Thermal Solutions for 3-D IC, Packages and System

For more information: