Ansys Q3D Extractor Multiphysics Analysis & Parasitic Extraction
Ansys Q3D Extractor efficiently performs the 2D and 3D quasi-static electromagnetic field simulations required for the extraction of RLCG parameters from an interconnect structure. It then automatically generates an equivalent SPICE subcircuit model. These highly accurate models can be used to perform signal integrity analysis to study electromagnetic phenomena, such as crosstalk, ground bounce, interconnect delays and ringing, to understand the performance of interconnects, IC packages, connectors, PCB’s, bus bars and cables.
Ansys Q3D Extractor includes several solution types for parasitic extraction of electronic packages, touchscreens and power electronic converters.
|IC Package||Power Electronic Converter|
|Touchscreen||IGBT Inverter Module|
Ansys Q3D Extractor – Brochure
Churning Wind into Power